AMD Ryzen™ 9 7900X3D Desktop Processors Box
Review: 5 - "A masterpiece of literature" by , written on May 4, 20020
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AMD Ryzen™ 9 7900X3D Desktop Processors Box

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    • Series: Ryzen 7000 Series
    • Form Factor: Desktops, Boxed Processor
    • Market Segment: Enthusiast Desktop
    • AMD PRO Technologies: No
    • Consumer Use: Yes
    • Regional Availability: Global
    • Former Codename: Raphael AM5
    • Architecture: Zen 4
    • Number of CPU Cores: 12
    • Multithreading (SMT): Yes
    • Number of Threads: 24
    • Max. Boost Clock: Up to 5.6 GHz
    • Base Clock: 4.4 GHz
    • L1 Cache: 768 KB
    • L2 Cache: 12 MB
    • L3 Cache: 128 MB
    • Default TDP: 120W
    • Processor Technology for CPU Cores: TSMC 5nm FinFET
    • Processor Technology for I/O Die: TSMC 6nm FinFET
    • CPU Compute Die (CCD) Size: 71mm²
    • I/O Die (IOD) Size: 122mm²
    • Package Die Count: 3
    • AMD EXPO™ Memory Overclocking Technology: Yes
    • Precision Boost Overdrive: Yes
    • Curve Optimizer Voltage Offsets: Yes
    • AMD Ryzen™ Master Support: Yes
    • CPU Socket: AM5
    • Supporting Chipsets: A620, X670E, X670, B650E, B650
    • CPU Boost Technology: Precision Boost 2
    • Instruction Set: x86-64
    • Supported Extensions: AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX-plus, SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
    • Thermal Solution (PIB): Not Included
    • Recommended Cooler: Liquid cooler recommended for optimal performance
    • Max. Operating Temperature (Tjmax): 89°C
    • Series: Ryzen 7000 Series
    • Form Factor: Desktops, Boxed Processor
    • Market Segment: Enthusiast Desktop
    • AMD PRO Technologies: No
    • Consumer Use: Yes
    • Regional Availability: Global
    • Former Codename: Raphael AM5
    • Architecture: Zen 4
    • Number of CPU Cores: 12
    • Multithreading (SMT): Yes
    • Number of Threads: 24
    • Max. Boost Clock: Up to 5.6 GHz
    • Base Clock: 4.4 GHz
    • L1 Cache: 768 KB
    • L2 Cache: 12 MB
    • L3 Cache: 128 MB
    • Default TDP: 120W
    • Processor Technology for CPU Cores: TSMC 5nm FinFET
    • Processor Technology for I/O Die: TSMC 6nm FinFET
    • CPU Compute Die (CCD) Size: 71mm²
    • I/O Die (IOD) Size: 122mm²
    • Package Die Count: 3
    • AMD EXPO™ Memory Overclocking Technology: Yes
    • Precision Boost Overdrive: Yes
    • Curve Optimizer Voltage Offsets: Yes
    • AMD Ryzen™ Master Support: Yes
    • CPU Socket: AM5
    • Supporting Chipsets: A620, X670E, X670, B650E, B650
    • CPU Boost Technology: Precision Boost 2
    • Instruction Set: x86-64
    • Supported Extensions: AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX-plus, SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
    • Thermal Solution (PIB): Not Included
    • Recommended Cooler: Liquid cooler recommended for optimal performance
    • Max. Operating Temperature (Tjmax): 89°C