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AMD Ryzen™ 9 7900X3D Desktop Processors Try

AMD Ryzen™ 9 7900X3D Desktop Processors Try

AMD Ryzen™ 9 7900X3D Desktop Processors Try

AMD Ryzen™ 9 7900X3D Desktop Processors Try

AMD Ryzen™ 9 7900X3D Desktop Processors Try

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Available:Out of Stock

Product SKU: 108178

625.000 IQD

Description
Reviews

- Series: Ryzen 7000 Series
- Form Factor: Desktops, Boxed Processor
- Market Segment: Enthusiast Desktop
- AMD PRO Technologies: No
- Consumer Use: Yes
- Regional Availability: Global
- Former Codename: Raphael AM5
- Architecture: Zen 4
- Number of CPU Cores: 12
- Multithreading (SMT): Yes
- Number of Threads: 24
- Max. Boost Clock: Up to 5.6 GHz
- Base Clock: 4.4 GHz
- L1 Cache: 768 KB
- L2 Cache: 12 MB
- L3 Cache: 128 MB
- Default TDP: 120W
- Processor Technology for CPU Cores: TSMC 5nm FinFET
- Processor Technology for I/O Die: TSMC 6nm FinFET
- CPU Compute Die (CCD) Size: 71mm²
- I/O Die (IOD) Size: 122mm²
- Package Die Count: 3
- AMD EXPO™ Memory Overclocking Technology: Yes
- Precision Boost Overdrive: Yes
- Curve Optimizer Voltage Offsets: Yes
- AMD Ryzen™ Master Support: Yes
- CPU Socket: AM5
- Supporting Chipsets: A620, X670E, X670, B650E, B650
- CPU Boost Technology: Precision Boost 2
- Instruction Set: x86-64
- Supported Extensions: AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX-plus, SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
- Thermal Solution (PIB): Not Included
- Recommended Cooler: Liquid cooler recommended for optimal performance
- Max. Operating Temperature (Tjmax): 89°C

- Series: Ryzen 7000 Series
- Form Factor: Desktops, Boxed Processor
- Market Segment: Enthusiast Desktop
- AMD PRO Technologies: No
- Consumer Use: Yes
- Regional Availability: Global
- Former Codename: Raphael AM5
- Architecture: Zen 4
- Number of CPU Cores: 12
- Multithreading (SMT): Yes
- Number of Threads: 24
- Max. Boost Clock: Up to 5.6 GHz
- Base Clock: 4.4 GHz
- L1 Cache: 768 KB
- L2 Cache: 12 MB
- L3 Cache: 128 MB
- Default TDP: 120W
- Processor Technology for CPU Cores: TSMC 5nm FinFET
- Processor Technology for I/O Die: TSMC 6nm FinFET
- CPU Compute Die (CCD) Size: 71mm²
- I/O Die (IOD) Size: 122mm²
- Package Die Count: 3
- AMD EXPO™ Memory Overclocking Technology: Yes
- Precision Boost Overdrive: Yes
- Curve Optimizer Voltage Offsets: Yes
- AMD Ryzen™ Master Support: Yes
- CPU Socket: AM5
- Supporting Chipsets: A620, X670E, X670, B650E, B650
- CPU Boost Technology: Precision Boost 2
- Instruction Set: x86-64
- Supported Extensions: AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX-plus, SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
- Thermal Solution (PIB): Not Included
- Recommended Cooler: Liquid cooler recommended for optimal performance
- Max. Operating Temperature (Tjmax): 89°C

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