Thermalright TF9 (2.9g) Thermal Paste

• Model: Thermalright TF9 Thermal Paste – 2.9g
• Type: High-performance thermal compound
• Net Weight: 1.5 grams
• Thermal Conductivity: 12.8 W/m·K
• Thermal Resistance: <0.0018 °C·in²/W
• Viscosity: 250 poise
• Density: 2.6 g/cm³
• Color: Gray
• Operating Temperature: -220 °C to +380 °C
• Electrically Conductive: No (non-conductive, safe for electronic components)
• Application: CPU, GPU, and other high-performance chipsets
• Packaging: Syringe-type applicator for easy use
• Features:
 – High thermal conductivity for efficient heat transfer
 – Stable performance under extreme conditions
 – Long-lasting durability without drying or cracking
 – Safe for use with all heatsinks and cooling solutions